Chiplet Physical Design Engineer

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities.

As a Senior Chiplet Physical Design Engineer at Tenstorrent , you will work on a high-profile, cutting-edge program designing and integrating multiple chiplets into a System-in-Package (SiP). You’ll collaborate closely with Tenstorrent experts and leaders across the USA, Japan, and other global sites, as well as external partners, to deliver world-class CPU and AI silicon. In this role, you will own critical aspects of synthesis and place-and-route for high-speed CPU core designs, contributing directly to performance, power, and area outcomes on advanced process nodes.